Bake-out conditions (time and temperature) for SMT parts should be provided by the part manufacturer.  However, in most cases manufacturers specify the industry standard bake: 125 °C for 24 hours [1].  Obviously this condition cannot be optimal for all cases.  For example, if deterioration of solderability and lead finishing at high temperatures is a concern, the maximum allowable temperature must be decreased (sometimes temperatures as low as 40 °C are recommended).  The bake-out times depend on the size and shape of the package; however, in most cases these factors are neglected.  One may use the bake-out regimens recommended by IPC standard (IPC-TM-650): 125 °C for 6 hours for packages with less than 2 mm of body thickness, and 24 hours for thicker packages.